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Effect of High-Temperature Annealing on Electrical and Optical Properties of Undoped Semi-Insulating GaAs

机译:高温退火对未掺杂半绝缘GaAs的电和光性能的影响

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摘要

A comprehensive characterization, including room temperature Hall effect, near infrared absorption, temperature dependent dark current and photocurrent (using 1.13 eV light), normalized thermally stimulated current (NTSC), photoluminescence at 4.2 K in both near band edge and deep level regions, and selective pair photoluminescence (SPL) at 2 K, has been carried out on undoped semi-insulating GaAs samples, cut from four wafers which were grown by the low pressure liquid encapsulated Czochralski technique and annealed by three different schedules: a 1100 °C anneal with either fast or slow cooling, or a 1000 °C standard anneal. The 1100 °C anneal clearly introduces higher concentrations of NTSC traps near 0.3 and 0.5 eV, a PL center at 0.8 eV, and acceptor centers, which are mainly due to the point defects and increase the resistivity. Slow cooling to some extent reduces all of these additional centers. The SPL measurements show changes in the relative intensities of C, Zn, and Si related emissions with changes in annealing conditions. © 1998 American Institute of Physics.
机译:全面的特性描述,包括室温霍尔效应,近红外吸收,与温度相关的暗电流和光电流(使用1.13 eV光),归一化的热激发电流(NTSC),在能带附近和深能级区域内在4.2 K处的光致发光,以及在未掺杂的半绝缘GaAs样品上进行了2 K的选择性对光致发光(SPL),该样品是从四个晶片切割而成的,这些晶片是通过低压液体封装的Czochralski技术生长的,并通过三种不同的时间表进行了退火:1100 C退火快速或缓慢冷却,或1000 C标准退火。 1100 C退火明显引入了更高浓度的NTSC阱,接近0.3和0.5 eV,PL中心为0.8 eV,以及受主中心,这主要是由于点缺陷和电阻率增加所致。缓慢冷却在某种程度上减少了所有这些额外的中心。 SPL测量结果显示,随着退火条件的变化,C,Zn和Si相关发射的相对强度也会发生变化。 ©1998美国物理研究所。

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